Standard pad size :
Φ50mm
Large cleaning pad size :
75*118mm
Benefit of Cleaning pad improvement
This experiment used same device file and probe card to do production.
Capability after replaced to be Porous Chuck Table
LCD device
The cleaning area is 1:3.
It is meaning if use square model cleaning pad will extend 3 times timing to replace the cleaning paper. So UPH should be up.
Thin wafer solution on UF200 serial
Capability:
8” normal wafer.
8” 6 mil dummy wafer. (Warppage 3000 um)
6” normal wafer.
6” 6 mil dummy wafer. (Warppage 3000 um)
Thin wafer solution on UF3000 serial
